C-TS422-1809 Exam Certification Details:
| Sample Questions: | SAP C-TS422-1809 Exam Sample Question |
| Cut Score: | 68% |
| Exam: | 80 questions |
| Level: | Associate |
| Duration: | 180 mins |
| Languages: | German, English, Spanish, Japanese, Korean, Chinese |
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SAP C-TS422-1809 Certification Exam Topics:
| Topic Areas | Topic Details, Courses, Books |
|---|---|
| Introduction to SAP S/4HANA < 8% | Describe how SAP S/4HANA Enterprise Management simplifies business processes.
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| SAP S/4HANA Production Methods < 8% | Describe how SAP S/4HANA supports various production methods.
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| SAP S/4HANA Essentials < 8% | Describe how SAP S/4HANA supports best practices.
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| Lean Manufacturing in SAP S/4HANA 8% - 12% | Describe what is meant by Lean Manufacturing in SAP S/4HANA.
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| Material Requirements Planning in SAP S/4HANA 8% - 12% | Describe how MRP supports the production planning process in SAP S/4HANA.
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| Innovations of SAP S/4HANA Enterprise Management for Logistics < 8% | Describe the innovations in Logistics applications within SAP S/4HANA.
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| Master Data in SAP S/4HANA > 12% | Outline the key master data used in Production Planning and Manufacturing.
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| SAP S/4HANA Planning Methods < 8% | Describe how SAP S/4HANA supports demand planning.
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| Advanced Planning in SAP S/4HANA > 12% | Describe key aspects of Advanced Planning in SAP S/4HANA.
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| Production Orders in SAP S/4HANA > 12% | Describe how Production Orders support the manufacturing process in SAP S/4HANA.
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| Process Orders in SAP S/4HANA < 8% | Describe how orders are processed using Good Manufacturing Practices in S/4HANA.
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SAP C-TS422-1809 Exam Description:
The "SAP Certified Application Associate - SAP S/4HANA Production Planning and Manufacturing" certification exam validates that the candidate possesses the fundamental and core knowledge required of the SAP S/4HANA Manufacturing consultant profile. This certification proves that the candidate has an overall understanding and in‐depth technical skills to participate as a member of a project team in a mentored role.
