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HP HP2-T19 Exam Syllabus Topics:
| Section | Weight | Objectives |
|---|---|---|
| Topic 1: HP BladeSystem Products & Components | 25% | - ProLiant server blades - Interconnect modules and mezzanine cards - Storage options and SAN integration - c-Class and p-Class enclosures |
| Topic 2: Troubleshooting & Repair Procedures | 25% | - HP 6-step troubleshooting methodology - Diagnostic tools and log analysis - Component replacement and verification - Network and storage connectivity issues |
| Topic 3: Industry Standard Server & BladeSystem Technologies | 20% | - Power, cooling, and management architecture - BladeSystem enclosure infrastructure - Processor, memory, and system architecture |
| Topic 4: Installation, Configuration & Upgrades | 25% | - Firmware updates and system upgrades - Physical installation and rack integration - iLO and remote management setup - Onboard Administrator (OA) configuration |
| Topic 5: High Availability & Management Solutions | 5% | - Clustering and redundancy concepts - HP System Insight Manager and utilities |
